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january 2007 rev 2 1/11 11 order codes part number marking package packing STN83003 n83003 sot-223 tape & reel STN83003 high voltage fast-switching npn power transistor general features medium voltage capability low spread of dynamic parameters minimum lot-to-lot spread for reliable operation very high switching speed sot-223 plastic package for surface mounting circuits tape and reel packing applications electronics ballasts for fluorescent lighting switch mode power supplies description the device is manufactured using high voltage multi-epitaxial planar technology for high switching speeds and medium voltage capability. it uses a cellular emitter structure with planar edge termination to enhance switching speeds while maintaining the wide rbsoa. the STN83003 is expressly designed for a new solution to be used in compact fluorescent lamps, where it is coupled with the stn93003, its complementary pnp transistor. internal schematic diagrams sot-223 1 2 2 3 www.st.com
STN83003 2/11 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
STN83003 3/11 1 electrical ratings table 2. thermal data table 1. absolute maximum rating symbol parameter value unit v ces collector-emitter voltage (v be = 0) 700 v v ceo collector-emitter voltage (i b = 0) 400 v v ebo emitter-base voltage (i c = 0, i b = 0.75a, tp < 10 s, t j < 150c) v (br)ebo v i c collector current 1.5 a i cm collector peak current (t p < 5ms) 3 a i b base current 0.75 a i bm base peak current (t p < 5ms) 1.5 a p tot total dissipation at t c = 25c 1.6 w t stg storage temperature -65 to 150 c t j max. operating junction temperature 150 c symbol parameter value unit r thj-amb thermal resistance junction-ambient (1) _ max 1. device mounted on pcb area of 1 cm 2 . 78 c/w
electrical characteristics STN83003 4/11 2 electrical characteristics (t case = 25c unless otherwise specified) table 3. electrical characteristics symbol parameter test conditions min. typ. max. unit i cev collector cut-off current (v be = -1.5v) v ce = 700v v ce = 700v t j = 125c 1 5 ma ma v (br)ebo emitter-base breakdown voltage (i c = 0) i e = 10ma 12 18 v v ce(sus) (1) 1. pulsed duration = 300 s, duty cycle 1.5% collector-emitter sustaining voltage (i b = 0) i c = 10ma l = 25mh 400 v v ce(sat) (1) collector-emitter saturation voltage i c = 0.35a i b = 50ma i c = 0.5a i b = 0.1a 1 0.5 v v v be(sat) (1) base-emitter saturation voltage i c = 0.5a i b = 0.1a 1v h fe dc current gain i c = 10ma v ce = 5v i c = 0.35a v ce = 5v i c = 1a v ce = 5v 10 16 4 25 32 t r t s t f resistive load rise time storage time fall time i c = 0.35a v cc = 125v i b1 = -i b2 = 70ma t p 25 s (see figure 10) 1.5 100 2.2 0.2 2.9 ns s s t s t f inductive load storage time fall time i c = 0.5a i b1 = 0.1a v be(off) = -5v l = 10mh v clamp = 300v (see figure 9) 450 90 ns ns
STN83003 5/11 2.1 electrical characteristics (curves) figure 1. safe operating area figure 2. dc current gain figure 3. dc current gain figure 4. collector-emitter saturation voltage figure 5. base-emitter saturation voltage figure 6. resistive load storage time
electrical characteristics STN83003 6/11 figure 7. resistive load storage time figure 8. inductive load storage time figure 9. inductive load fall time
STN83003 7/11 2.2 test circuits figure 10. inductive load switching test circuit figure 11. resistive load switching test circuit 1) fast electronic switching 2) non-inductive resisitor 3) fast recovery rectifier 1) fast electronic switching 2) non-inductive resisitor
package mechanical data STN83003 8/11 3 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
STN83003 9/11 dim. mm inch min. typ. max. min. typ. max. a 1.80 0.071 b 0.60 0.70 0.80 0.024 0.027 0.031 b1 2.90 3.00 3.10 0.114 0.118 0.122 c 0.24 0.26 0.32 0.009 0.010 0.013 d 6.30 6.50 6.70 0.248 0.256 0.264 e 2.30 0.090 e1 4.60 0.181 e 3.30 3.50 3.70 0.130 0.138 0.146 h 6.70 7.00 7.30 0.264 0.276 0.287 v10 o 10 o a1 0.02 p008b sot-223 mechanical data
revision history STN83003 10/11 4 revision history table 4. revision history date revision changes 09-may-2006 1 initial release. 17-jan-2007 2 the device?s safe operating area curve has been added on page 5.
STN83003 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at an y time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorize representative of st, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems, where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as ?automotive grade? may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, an y liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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